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地 址：江苏省泰州市靖江城南
园区中洲西路189号
电 话：+86-523-84129190
手 机：邵蜜斯 18261054102
展蜜斯 15189930681
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Currently, we own two KNS machines with 300 pieces wafer per month. (Gold Bump or Alloy Bump for 8”) PROCESS CAPABILIT |
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Wire Size 17 micron to 50 micron Gold 20 micron to 33 micron Copper Bump Processes AccuBump Standard Bump Stacked Bump Productivity Standard Bump: 36 bumps per second AccuBump: 30 bumps per second Some applications affect raw speed |
Bump Height Variation Average height is processdependent AccuBump: + 3 µm at + 3 sigma Standard Bump: + 15 µm at + 3 sigma Pitch Capability 60 µm in-line at + 3 sigma, standard 50 µm in-line at + 3 sigma, at lower speed Total Bond Placement Accuracy + 3.5 µm at 3 sigma Wafer Sizes 50 mm to 200 mm Manual Wafer Chuck |
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地址：江苏省泰州市靖江城南园区中洲西路189号